innovation for industry
From 2/5/2020 to 2/5/2020
San Francisco W-hotel, San Francisco, California, United States.
Join us to discuss the new visions, directions and paradigms on photonics technologies for a broad range of applications, including sensing and quantum technologies.
The purpose of this workshop is to illustrate how Leti can facilitate widespread photonics adoption from high-end to mass-market applications through miniaturization and integration.
Pat Tang, VP Hardware Technology and Machine Learning at Amazon Lab126 (Sunnyvale, California) will kick off the event.
Pat Tang is a Technology VP at Amazon Lab126. He has led the development of cloud-based simulation to aid the design of thin, lightweight, reliable products like Kindle Fire HDX Tablets and Kindle e-Readers. Challenging industrial designs like FireTV and Alexa Echo devices were also realized. He has built teams of architectural simulation, materials testing, Product reliability and Field Database analysis. All to ensure that cutting edge technologies are delivered in a fast-paced consumer market.
The workshop will conclude with a reception with many opportunities for discussion and networking.
Leti also will exhibit at Photonics West Feb. 4-6, in booth #857A, French Pavilion, at the Moscone center.
Emmanuel Sabonnadière, CEA-Leti CEO& Agnès Arnaud, CEA-Leti Head of Optics & Photonics Division
Keynote: Working backwards from the costumer to the sensor
Pat TangAmazon, Lab126, VP Technology
New miniature sensors of particulate matter using angular spectral imaging
Laurent DuraffourgCEA-Leti, Photonics Sensors Lab. Manager
Francois SimoensCEA-Leti, Executive Strategic Program Manager
Cédric AllierCEA-Leti, PhD Project Manager, Live Cell Imaging
Low-loss silicon photonics platform for quantum technologies
Eleonore HardyCEA-Leti, Business Developer, Silicon Photonics
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San Francisco Marriott Marquis, CA, USA
The International Solid-State Circuits Conference (ISSCC) is the foremost global forum for presentation of advances in solid-state circuits and systems-on-a-chip
Alpexpo: 2 Avenue d'Innsbruck, 38100 Grenoble
The 23rd edition of the DATE international conference will take place at Alpexpo – Grenoble (France), from March 9 to 13, 2020. It is the largest European gathering in the fields of microelectronic design and embedded systems.
The CEA will notably be present through its two institutes List and Leti, on booths 7&8 .
San Diego Convention Center, San Diego, California, USA.
The Optical Fiber Communication Conference and Exhibition (OFC) is the largest global conference and exhibition for optical communications and networking professionals.
Pioneering Silicon photonics and III-V on Si lasers for more than 15 years, Leti has designed a technology toolbox featuring state-of-the-art performance to support the development of your innovative Photonic Integrated Circuit for high-speed optical communications, LIDAR, quantum and neuromorphic applications. Access to Leti's 200 or 300 mm platforms is given through Multi Project Wafer and dedicated runs.
WTC - Congress center 5-7, place Robert Schuman - Grenoble, France.
MiNaPAD, the « Micro/Nano-Electronics Packaging & Assembly, Design and Manufacturing Forum » will be held in Grenoble, France, at the WTC congress center on May 27-28, 2020
MiNaPAD is a 2 days conference with an exhibition. The aim of this event is to reinforce the design community (which constitutes the largest share of the semiconductor community in Europe) and the assembly and packaging community:
Maison MINATEC 3 parvis Louis Néel, 38054 Grenoble
The 10th edition of the JNRSE – « National Days on Energy Harvesting and Storage » will take place on 27-28 May 2020 in Grenoble, France, organized by CEA-Leti and TIMA.
CEA is a French government-funded technological research organisation in four main areas: low-carbon energies, defense and security, information technologies and health technologies. A prominent player in the European Research Area, it is involved in setting up collaborative projects with many partners around the world.