Join CEA-Leti CEO Sébastien Dauvé and a panel of tech experts
at Leti Innovation Day Taiwan in Hsinchu on April 9, 2024 Global semiconductor R&D leader CEA-Leti is bridging the gap between lab and fab as the partner of choice for innovative businesses seeking a one-stop-shop for their advanced technology R&D needs.
CEA-Leti R&D partners benefit from the institute’s state-of-the-art R&D facilities
and proven technology transfer program. Don’t miss this opportunity to meet with CEA-Leti and partners and explore the potential
for R&D partnerships in Taiwan. This event is organized in collaboration with SEMI and the French Office in Taipei, which is the official
representation of France in Taiwan and is strongly involved to foster cooperation
in all fields, including semiconductors.
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A keynote speech will be given by Pierre Barnabé, CEO, Soitec
One of CEA-Leti’s most emblematic spinoffs, Soitec is today among the world’s top suppliers of innovative semiconductor materials.
Soitec CEO Pierre Barnabé will talk about how the company is addressing sustainability, one of the key challenges of our times. |
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| Franck Paris
Director of the French Office in Taipei |  Sébastien DauvéCEO, CEA-Leti
| Director General TSRI, Chair Professor NYCU |
 Clark Tseng
Sr. Director of Market Intelligence, SEMI
| Semiconductor
Technologies Partnerships Manager, CEA-Leti,
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Sylvie Joly
3D Integration and Bonding Division, CEA-Leti | | Benoit Charbonnier Optics and Photonics Division, CEA-Leti | Michael Tchagaspanian EVP, Strategic Partnerships, CEA-Leti | Olivier Thomas Deputy Head of the Integrated Circuit & System Division, CEA-List |
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Program
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2:00 p.m. - 4:30 p.m.
Explore a spectrum of topics through engaging presentations:
Semiconductor market trends Innovative semiconductor materials,
the key to a sustainable future CEA-Leti partner success stories Trends in emerging non-volatile memories CMOS-compatible silicon photonics for high-performance computing and data transmission
| Advanced CMOS and memory-based technologies for more sustainable computing systems Innovative RF technologies for next-generation telecommunications Innovative solutions for advanced 3D packaging Innovative digital processing architectures for next-generation electronics Partnering with CEA-Leti
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Leti Innovation Days Taiwan 2024 is organized by CEA-Leti in conjunction with
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For more information, please contact Evelyne Etchebehere
Supported by Carnot network of French RTOs