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Thermal performance of CoolCube™ monolithic and TSV-based 3D integration processes

Published on 29 March 2018
Thermal performance of CoolCube™ monolithic and TSV-based 3D integration processes
Description
 
Date 
Authors
Santos C., Vivet P., Thuries S., Billoint O., Colonna J.-P., Coudrain P., Wang L.
Year2017-0335
Source-Title2016 IEEE International 3D Systems Integration Conference, 3DIC 2016
Affiliations
Univ. Grenoble Alpes, Grenoble, France, CEA, LETI, MINATEC Campus, Grenoble, France, STMicroelectronics, 850 rue Jean Monnet, Crolles, France, Calibre Design Solutions, Mentor Graphics, Fremont, CA, United States
Abstract
CoolCube™ is a monolithic 3D technology which has the potential to solve the interconnection density limitation of the existing TSV-based 3D integration processes. Since the active devices are fabricated on extremely this die substrates, heat dissipation has been pointed as a potential showstopper issue for this emerging technology. This work provides a comparative study of the thermal performance of the CoolCube and TSV-based 3D integration processes for a range of technology parameters and application scenarios. Results show that CoolCube exhibits thermal performance similar to or even better than the TSV-based technologies thanks to its very tight die-to-die thermal coupling. © 2016 IEEE.
Author-Keywords
 
Index-Keywords
Integration, Monolithic integrated circuits, 3-D integration, Application scenario, Comparative studies, Emerging technologies, Interconnection density, Technology parameters, Thermal coupling, Thermal Performance, Three dimensional integrated circuits
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