Evénement |  Couvent des Jacobins, Rennes, France

Le CEA-Leti s’est appuyé sur son expertise en systèmes embarqués et en cybersécurité pour développer CRAB, un banc de caractérisation et de test complet pour analyser la sécurité logicielle et matérielle des systèmes embarqués. Vous pour échanger autour de ce nouvel outil aux performances élevées, à des coûts maitrisés, et basé sur des technologies ouvertes.

Evénement | Agenda |  SEMICON Europa, Messe München, Germany.

Artificial intelligence is reshaping the semiconductor landscape, demanding breakthroughs across the entire technology stack. This session explores the deep-tech innovations enabling the AI era—from advanced compute, 3D integration and silicon photonics to power-efficient packaging—before showcasing two real-world demonstrations and concluding with Europe’s vision for sustainable AI infrastructure. During this 19th edition of Leti Innovation Days Tokyo, CEA-Leti’s CEO will celebrate R&D partnerships with its partners in Japan and explore new possibilities to support the Japanese semiconductor industry. This year’s theme is “The AI-Chip Revolution: Scaling Innovation in Semiconductors”. High-level speakers and technical experts will present the latest advances through keynote speeches, seminars and live demos. Join us to enjoy lively networking and exchanges in a unique setting at the Residence of France in Japan.

Evénement |  Munich, Allemagne

Physical AI begins with sensing. As AI moves into the physical world, application-specific sensors are becoming essential for enabling efficient, reliable, and scalable systems. This year the MEMS & Imaging Summit explores how sensor innovation, semiconductor technologies, and advanced manufacturing are shaping the next generation of Physical AI. From custom sensor design to system integration, industry experts will discuss how purpose-built sensing solutions are driving practical applications across medical, manufacturing and consumer applications.