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Awards & Honors

​awards & honors

Published on 19 May 2021


​IEEE Best Paper Runner-up Award for CEA-Leti automotive sensor data fusion research

A paper on “System-level Simulation of Cooperative Sensor Data Fusion Strategies for Improved Vulnerable Road Users Safety*” authored by CEA-Leti scientists Alex Pereira da Silva, Sylvain Leirens, and Benoît Denis won the Best Paper Runner-up Award at the IEEE 16th Workshop on Positioning, Navigation and Communications 2019 held in Bremen, Germany in October. The award-winning paper is on a flexible end-to-end system simulation platform capable of evaluating cooperative mapping strategies in complex driving environments.

Most notably, the overall simulation flow spans from sensor and Vehicle-to-X (V2X) connectivity abstractions up to fusion algorithms running at the application level to reveal information that cannot be detected by standalone on-board sensors. According to Pereira da Silva, “We are pleased to see the interdisciplinary work we did for the Carnot Automotive IoT project coupling sensor data processing with wireless connectivity recognized in this way. It is rewarding to know that the community appreciates the quality of our work.”

*Alex Pereira da Silva et al., “System-level Simulation of Cooperative Sensor Data Fusion Strategies for Improved Vulnerable Road Users Safety,” 16th Workshop on Positioning, Navigation and Communications (WPNC), Bremen, Germany, (2019): 1-6.

CEA-Leti PhD candidate brings award-winning new insights to ToF-SIMS polymer analysis

CEA-Leti PhD student Amal Ben Hadj Mabrouk won an "Excellent Presentation Award" at The 22nd International Conference on Secondary Ion Mass Spectrometry held in October 2019 for her talk on the impact of molecular weight on the characterization of polymer thin films using low energy Cs+ sputtering. Amal, a multi-talented engineer from Tunisia, is enrolled in a PhD program at the Sorbonne in Paris. Her PhD research at CEA-Leti focuses on ToF-SIMS characterization of polymer thin films. When she is not in the lab, Amal is an engaged environmental and social activist and loves to solo travel. This award at a major SIMS conference is a mark of recognition by the international SIMS community, not only of Amal's research, but of her presentation skills as well. "I was proud to show how diversity can be an asset in science while representing my lab at this international event. The fact that the conference was in Japan, one of my favorite countries, was an added bonus." This achievement is a prime example of the kinds of advances CEA-Leti is making in the field of ToF-SIMS for polymer characterization.


CEA-Leti brings home Best Antenna Design and Applications Paper award from EuCAP 2019

A team of scientists from CEA-Leti and the University of Rennes, France won an award for their paper* on electronically-steerable transmitarray antennas at the 13th European Conference on Antennas and Propagation (EuCAP) held in Krakow, Poland in the spring of 2019. CEA-Leti's Antonio Clemente was the principal author of the paper and presenter at the associated poster session. According to Clemente, "The awards are given for technical excellence, of course. But criteria like originality and innovation, significance to the AP community, potential impact, and clarity of presentation are also considered. Receiving one of these awards is a mark of the excellence of the proposed work at the international state of the art. Presenting our work at EuCAP also raised our profile worldwide, leading to a new partnership between CEA-Leti and a major Asian electronics manufacturer and early-stage talks with another manufacturer. Our paper and poster presentation reviewed CEA-Leti's research with IETR (University of Rennes) on electronically-steerable transmitarrays. Specifically, two transmitarrays with 20×20 and 14×14 elements were prototyped and characterized for operation in switchable circular or linear polarization. Wide electronically-steerable beam scanning was successfully demonstrated.

*"Electronically-Steerable Transmitarray Antennas for Ka-Band," Antonio Clemente (CEA-Leti), Luca Di Palma (CEA-Leti), Fatimata Diaby (CEA-Leti), Laurent Dussopt (CEA-Leti), Trung Kien Pham (IETR, Univ. Rennes I), Ronan Sauleau (IETR, Univ. Rennes I).

Advance in SRAM earns CEA-Leti/IMEP-LAHC PhD candidate VLSI-TSA Best Student Paper Award


A novel versatile assist for top-tier SRAMs caught the attention of the 2020 VLSI-TSA (Technology, Systems and Applications) Conference jury, winning CEA-Leti PhD student Daphnée Bosch the "Best Student Paper Award." The award, handed out in Hsinchu, Taiwan in August, recognizes Bosch's research on "Novel Fine-Grain Back-Bias Assist Techniques for 14nm FDSOI Top-Tier SRAMs integrated in 3D-Monolithic." 3D monolithic integration technology can be used to integrate a back gate behind each transistor to modulate the top gate threshold voltage modulation without the need to increase the silicon footprint. The groundbreaking design delivered a 7% bitline capacitance reduction and shortened read/write access time by 12%/16% for a 60 mV minimum operating voltage at 6 sigma. Bosch, whose PhD research is on junctionless FDSOI transistors for 3D monolithic integration and in-memory computing, said the award is the direct result of "the complementary strengths of the many different laboratories I interacted with for this research." 


2019 ETRI Journal Best Paper Award for joint EU-South Korean 5GCHAMPION project

Emilio Calvanese Strinati and Antonio Clemente won a 2019 ETRI Journal Best Paper Award for their contribution to the EU-South Korea 5GCHAMPION project (coordinated by CEA-Leti) to develop the first fully-integrated and operational 5G testbed, which was showcased at the PyeongChang 2018 Olympic Winter Games. According to Emilio, "The award is an honor and a testament to our long-standing collaboration with ETRI and other Korean partners." Antonio said, "As a researcher at CEA-Leti, this award represents a major milestone, marking a decade of innovation and research on 5G." ETRI Journal grants the award to the best original paper published in the journal each year, selected by an editorial board made up of internationally-recognized researchers.



 



CEA-Leti PhD candidate breaks new ground in positioning technology for IoT applications

The 2018 15th Workshop on Positioning, Navigation and Communications (WPNC) brought together stakeholders spanning industry and academia to discuss hot tech topics like IoT, Industry 4.0, autonomous vehicles, and 5G communications. Florian Wolf, a PhD candidate at CEA-Leti, received the WPNC Best Paper Award for research that could lead to an alternative to Global Navigation Satellite System positioning for a wide range of IoT applications. The joint award recognized research Wolf conducted with Jean-Baptiste Doré, Xavier Popon, Sébastien de Rivaz, François Dehmas (Leti), and Jean-Pierre Cances  (the University of Limoges) on a new location technique that utilizes phase-coherent multi-channel processing of narrowband signals. According to Wolf, CEA-Leti's capacity to innovate at all stages, from theoretical research through to proof-of-concept implementations, was instrumental in this award-winning work. 

"Coherent Multi-Channel Ranging for Narrowband LPWAN: Simulation and Experimentation Results.", F. Wolf, J.-B. Doré, X. Popon, S. de Rivaz, F. Dehmas, J.-P. Cances.


CEA-Leti’s Gabriel Molas earns IEEE Senior Member status

Gabriel Molas, CEA-Leti’s senior expert in non-volatile memory in charge of several RRAM projects at CEA-Leti and CEA-Leti microelectronics service scientific representative, earned IEEE Senior Member Status in 2019. This achievement recognizes a particularly prolific career marked by more than 150 international conference publications, 50 papers in peer-reviewed journals, and 25 patents. Molas is also active in the electronics research community, serving as a reviewer for several journals and participating in technical and organizing committees.

According to Molas, “Senior membership is a mark of my peers’ recognition of my work. In addition to being eligible for IEEE executive volunteer positions, I will also be more visible, which will increase the likelihood of being invited to speak at high-level conferences. Finally, IEEE senior membership can boost the acceptance rates of projects submitted for ERC grants and other sources of funding from the EU.”

IEEE is the world’s largest technical professional organization dedicated to advancing technology for the benefit of humanity. To be eligible for senior membership, candidates must demonstrate professional maturity, have at least ten years’ professional experience, and show significant performance over a period of at least five years of professional practice.



CEA and partners win Best Publicly-Funded Project Demonstrator Award at OE-A Competition 2019

CEA-Leti and its partners in the EU PYCSEL project (coordinated by CEA-Liten) won an OE-A award (for multifunctional demonstrators utilizing organic and printed electronics) for their contributions to the development of a large conformable fingerprint sensor, ultimately for government and automotive (biometric driver identification) applications. CEA-Leti scientist Jean-François Mainguet, who drew on his prior fingerprint acquisition expertise, said, "This award recognizes some of my patented innovations in the fingerprint acquisition domain related to the use of pyroelectric material—PVDF-TrFE in this case—as a thermal sensing material. This was only one aspect of the project, however, and CEA-Liten and the other European project partners also contributed their diverse know-how, in what turned out to be an exemplary collaborative R&D project." 



Award-winning hardware security book authored by CEA-Leti scientists

CEA-Leti scientists Olivier Savry, Thomas Hiscock, and Mustapha El Majihi won the 2019 European Cybersecurity Week "Best Technical Book" award for their book entitled Sécurité matérielle des systèmes :  Vulnérabilité des processeurs et techniques d'exploitation* [Systems hardware security:  Vulnerability of processors and operating techniques]. 

The book, written for IT and electronics developers and students, provides a thorough review of hardware vulnerabilities in the processors that power our electronic systems. The authors also describe vulnerabilities specific to memory, programs, and peripheral devices, and give an update on the latest known threats.

European Cybersecurity week is a leading international cybersecurity event. The book was selected by a panel of industrial cybersecurity experts (from Nokia, Airbus, and other companies) coordinated by PEC (Pôle d'Excellence Cyber), a French cybersecurity cluster.

* Savry, Olivier, Thomas Hiscock, and Mustapha El Majihi. Sécurité matérielle des systèmes : Vulnérabilité des processeurs et techniques d'exploitation. Paris: Dunod, 2019.

IEEE Best Session Paper Award for CEA-Leti active interposer technology

A paper on "Active Interposer Technology for Chiplet-Based Advanced 3D System Architectures*" authored by CEA-Leti scientists won the Best Session Paper award at the IEEE 69th Electronic Components and Technology Conference (ECTC) held in Las Vegas in May 2019. Their groundbreaking work details the first successful integration of chiplets on a fully packaged and tested active silicon interposer with state-of-the-art, 20 µm-pitch, 3D interconnects—an advance that will ultimately support high-performance computing (HPC) applications. 

Perceval Coudrain, a former STMicroelectronics engineer who came to CEA-Leti in 2018 to conduct research on 3D integration, FanOut wafer-level packaging, and embedded microfluidics, is particularly pleased about this award. He said, "Our paper was a group endeavor. It is also a wonderful example of the kind of long-term, multidisciplinary research we do at CEA-Leti. We were able to leverage the active interposer chiplet our designers have been promoting for years in a realistic 3D integration and packaging concept, overcoming some major technological hurdles in the process." 

*P. Coudrain et al., "Active Interposer Technology for Chiplet-Based Advanced 3D System Architectures," 2019 IEEE 69th Electronic Components and Technology Conference (ECTC), Las Vegas, NV, USA, 2019, pp. 569-578, doi: 10.1109/ECTC.2019.00092.




Professor Raj Mittra special prize awarded to CEA-Leti PhD candidate at iWAT 2020

CEA-Leti PhD student Rana Berro won the Professor Raj Mittra special prize at the 2020 IEEE International Workshop on Antenna Technology (iWAT 2020) in Bucharest, Romania. The award came for her poster "Analysis of the Effects of Conductivity on Small Antenna Characteristics" authored with Serge Bories and Christophe Delaveaud. In this original research, which was inspired by work dating back to the middle of the last century, analytical formulations of electromagnetism were used to develop a circuit model, which was then used to test the fundamental limits of electrically small antennas. Today, electromagnetic simulators tend to be used for this kind of research. 

Berro's team was able to predict the essential characteristics of miniature antennas without resorting to the simulators. Berro, who is from Lebanon, said, "The award was a boost to my self-confidence after some serious issues my family in Lebanon was facing that made it difficult for me to focus on my work during the notoriously difficult second year of the PhD, when many researchers tend to feel stuck. The award restored my faith in my abilities and made me proud to be part of one of the world's leading research organizations." 



CEA-Leti wins 3D InCities 2019 Research Institute of the Year award for outstanding advanced and 3D packaging activities

3D InCities, an online 3D and packaging community, honored CEA-Leti with its 2019 Research Institute of the Year award for achievements in 3D and advanced packaging. CEA-Leti's IntAct active silicon interposer technology is one of the notable advances that contributed to the win. In addition to resulting in several publications, IntAct is a prime illustration of CEA-Leti's work within the IRT Nanoelec TRO framework and of its R&D partnerships with businesses.

Other advances in 3D sequential technology at CEA-Leti produced the CoolCubeTM chip. Finally, the institute made notable progress in hybrid bonding, substantially boosting interconnect densities, key to tighter integration and greater efficiency. Séverine Chéramy, who heads 3D projects at CEA-Leti, said, "This award recognizes CEA-Leti's achievements over a number of years, demonstrating not only our scientists' leadership in 3D, but also our strong partnerships with companies in the micro and nanoelectronics industry." CEA-Leti received the award at the IMAPS Device Packaging conference in March 2019, in Phoenix, Arizona. 




Best Session Paper Award 2019 IEEE 69th Electronic Components and Technology Conference (ECTC)

CEA-Leti CMP specialists Daniel Scevola and Yorrick Exbrayat brought home a Best Session Paper Award from ECTC in Las Vegas in May 2019 for their 3D chiplet integration work. In a world-first, their team successfully integrated chiplets on a fully processed, packaged, and tested active silicon interposer. 

According to Daniel, "The award is recognition of the strong synergies between our teams at CEA-Leti and the complementarity of our scientists' profiles." This type of 3D integration will play an important role in tomorrow's high-performance computing (HPC) systems.