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Articles ＆ files | Focus | Micro-nanoelectronics
Next generation hybrid bonding
An enabling technology for new architectures
For more than 10 years, CEA-Leti has participated in the public-private French Nanoelec ecosystem, which represents 22 core partners. To deliver advanced packaging and die-to-wafer hybrid bonding, CEA-Leti partners with equipment manufacturers (SET, EVG, etc.) and adapts specific die-to-wafer processes from pick and place technology to self-assembly for improved throughput and alignment accuracy.
CEA-Leti is also working on new integration technologies such as self-assembly. This advance enables higher alignment performance (+/- 200 nm) and increased throughput (thousands dies/h).
• Chiplet integration for HPC (high performance computing), edge IA or optical computing
• Future memory
• Photonic devices
• Radio frequency
Technological advances supported by cutting-edge research with:
• An Outstanding Interactive Presentation Paper (ECTC 2022)
• Papers published in ECTC 2022 and ESTC 2022
• Seven papers presented to ECTC 2023
• A cover story by Chip Scale Review (Oct. 2022)
CEA is a French government-funded technological research organisation in four main areas: low-carbon energies, defense and security, information technologies and health technologies. A prominent player in the European Research Area, it is involved in setting up collaborative projects with many partners around the world.