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MEMS and NEMS—micro- and nanoelectromechanical systems—are tiny devices like sensors, actuators, and micromirror arrays, with moving parts that are sensitive to a physical quantity like speed, pressure, or direction. They convert this physical quantity into an electrical signal, which can, in some cases, operate an integrated micro-actuator.
CEA-Leti invites decision makers on the lookout for innovative and promising chip-based R&D, as well as editors, analysts and entrepreneurs to peruse the institute's reader-friendly "2023 Highlights" report
Constantly yielding important breakthroughs, epitaxy research is an extremely dynamic field. Epitaxy involves developing techniques to produce high-quality monocrystalline films with specific properties. Accurately controlling film growth, doping, and heterostructure formation has turned the method into a crucial component for the semi-conductor industry, enhancing the performance, scalability, and integration of semi-conductors.
Having devoted their thesis to this topic, Justine and Marvin received awards for their innovations.
The field of satellite technology is undergoing a revolution with the development of “New Space” and miniaturized antennas. As space becomes increasingly crowded and raises the need for optimized power directions, the ability to reduce the size and weight of satellite antennas while maintaining their performance is essential. Marwan Jadid delivered encouraging results during his presentation, showing how these advancements are expanding possibilities for applications and services that were once thought impossible.
Human and animal health and the environment are inextricably linked. CEA is developing enabling technologies to support an integrated approach that spans diagnostics, therapeutics, prevention, and monitoring.
Advanced 3D packaging is a complex technology that is expected to become increasingly important in packaging a wide range of electronic devices in various fields such as IoT, AI, or medical fields. Finding viable solutions to meet the growing global demand for new integration developments has therefore become relevant.
As the number of IoT connections continues to expand, new data communication link solutions will be needed to cope with the data deluge and enable a more sustainable digital (r)evolution.
The surge in nanoelectronics and photonics has resulted from a need for miniaturized tools and devices that are an integral part of our lives. Additionally, it has now become necessary to consider innovation through issues involving planetary resources and energy consumption. Because it is installed in miniaturized devices, silicon-based CMOS technology is now central to these issues. This presents significant challenges for reaching a low energy consumption that aligns with current societal preoccupations.
As embedded AI algorithms become more sophisticated, they also become more data intensive. In-memory computing dramatically reduces the power consumption associated with data transfer between memory and logic while helping keep data more secure. New non-volatile memory technologies that imitate the human brain’s energy-efficient synapses are also driving new low-power solutions. CEA develops and integrates all these technologies for a range of IoT projects.
As the limits of Moore’s Law approach, advanced chip packaging has emerged as a solution for continued scaling. CEA offers a complete chiplet and 3D integration toolkit enabling a modular “one to many” approach that speeds up the development of new solutions for automotive, high-performance computing,data centers, imaging, and more.
By launching the NextGen project, CEA aims to develop new generations of FD-SOI chips with better energy efficiency. It will ensure the capacity to engineer the most advanced components and maintain French and European microelectronics competitive for the future markets.
Vitesco Technologies, a leading international provider of modern powertrain technologies and electric mobility solutions, presents the first outcome of its partnership with the CEA in France: Together they have developed a “switched battery” (SWIBA) management technology that further improves the overall performance of the powertrain of electric vehicles.
CEA-Leti and Intel announced a joint research project to develop layer transfer technology of two-dimensional transition-metal dichalcogenides (2D TMDs) on 300mm wafers with the goal to extend Moore’s Law beyond 2030.
For a while now, articles on the threat of artificial intelligence to certain professions have been circulating. While it is true that AI is changing the way we work, Salam Hamieh believes that the issue is not about machines replacing humans, but rather about humans and machines working together to achieve better results.
CEA-Leti is developing an innovative blood analysis technology that does not require a mass spectrometer, reagents or a qualified technician. This solution could be integrated into a portable device, which would facilitate use in areas with few healthcare facilities.
Results Reported in Nature Article Suggest Vertical GeSn Transistors May Someday Enable Low-Power, High-Performance Chips and Quantum Computers
Seven Papers Highlight Results with High-Level Integration of Technologies & Components for HPC/Edge-AI Chiplets, Optical Computing, Displays and Imagers
Gaël Pillonnet, a seasoned energy conversion expert at CEA-Leti, has come up with an ingenious solution that significantly reduces the energy consumption of traditional transistors, albeit at a slower computation speed. This opens up a host of possibilities for achieving energy efficiency and computational performance, especially in edge computing.
Lets congratulate Anthony Albanese for his best poster presentation for Chalcogenides for applications in photonics and neuromorphism: innovative materials, from their integration to photonic devices
CEA is a French government-funded technological research organisation in four main areas: low-carbon energies, defense and security, information technologies and health technologies. A prominent player in the European Research Area, it is involved in setting up collaborative projects with many partners around the world.