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Liste de actualités du Leti
European H2020 COSMICC Project Breakthroughs ‘Will Answer Tremendous Market Needs with a Target Cost per Bit that Traditional Wavelength-Division Multiplexing Transceivers Cannot Meet’
Integrated high-speed, low-power, and low-cost data transmission solutions were developed under the EU H2020 COSMICC* project. The purpose of the project was to respond to exponential growth in data center traffic.
VLSI 2020 Paper Details First Proof of Integration of FDSOI CMOS Devices
Processed at 500°C, for Further 3D Monolithic Integration
Researchers at CEA-Leti and CEA-List developed the world’s first low-power IoT node with an integrated artificial intelligence accelerator combined with an ultra-fast wake-up time. They presented the research that led to the groundbreaking chip* at the 2020 Symposia on VLSI Technology and Circuits (VLSI) on June 14.
Virtual Presentation During VLSI 2020 Details Transistors’ Performance And Power-Use Advantages Versus FinFET Devices
GRENOBLE, France – June 11, 2020 – CEA-Leti today announced its researchers have broken the throughput world record of 5.1 Gbps in visible light communications (VLC) using a single GaN blue micro- light-emitting diode (LED). Their data transmission rate of 7.7 Gbps achieved with a 10 µm microLED marks another step toward commercialization and widespread use of LiFi communication.
As countries around the world begin rolling out 5G wireless networks, CEA-Leti is looking ahead to sixth-generation technologies that will surpass the data-transfer capability of 5G.
Ultrasonic waves generated by an array of piezoelectric transducers could potentially remove water droplets, grease, and grime from transparent surfaces. Leti and Silicon Valley startup Innovasonic are exploring the technology’s potential.
CEA-Leti, a CEA Tech institute, unveiled a state-of-the-art demonstrator chip for high-performance computing applications at ISSCC 2020. The low-cost, energy-efficient processor is built on an innovative multi-core system that is both modular and expandable
Emmanuel Sabonnadière, CEO of CEA-Leti addressed his collaborators and trusted partners.
Developed in the Frame of IRT Nanoelec, by CEA-Leti and Davey Bickford’s Wireless, the System Features Electronic Detonators with Bi-Directional Radio Modules.
The city of San Francisco is keeping a close eye on air pollution with a little help from a startup from France and its real-time air-quality monitoring solution.
Mentor Graphics' Tanner design flow now includes a Process Design Kit (PDK) for CEA-Leti's 310 nm photonics platform. For CEA-Leti R&D partners developing circuits using 310 nm technology, the PDK will boost efficiency and save time.
IntAct for the device of the year, ChipInFlex for the process of the year and finally Leti for the institute of the year, all three were selected to compete for the award in their category. CEA-Leti is honoured to win the 3DInCites research institute of the year award.
GRENOBLE, France – April 2, 2020 – L-UTSOI, a “compact model” dedicated to FD-SOI technologies and developed by CEA-Leti, has been selected as a standard model by the Compact Model Coalition (CMC), a working group composed of the major semiconductor companies and part of the Silicon Integration Initiative (Si2).
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A new recycling solution for silicon wafers used for research purposes at Leti, a CEA Tech institute, was recently implemented with an aluminum foundry in a win-win partnership!
Scintil Photonics, a spinoff of Leti, a CEA Tech institute, recently raised €4 million. The company will use the influx of funds to produce prototypes of its circuit.
CEA is a French government-funded technological research organisation in four main areas: low-carbon energies, defense and security, information technologies and health technologies. A prominent player in the European Research Area, it is involved in setting up collaborative projects with many partners around the world.