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Article | High performance computing
Taking up tomorrow's computing challenges in a connected world: maintaining performance progress while curtailing power consumption.
New computing technologies
CEA-Leti has reported the world’s-first demonstration of 16-kbit ferroelectric random-access memory (FeRAM) arrays at the 130nm node that advances this energy-saving technology closer to commercialization. The breakthrough includes back-end-of-line (BEOL) integration of TiN/HfO2:Si/TiN ferroelectric capacitors as small as 0.16 µm², and solder reflow compatibility for the first time for this type of memory.
Rapid advances in resistive oxide memory (OxRAM) could soon put the technology on manufacturers' production lines.
Targeted Applications Include High-Dimensional Distributed Environmental Monitoring, Implantable Medical-Diagnostic Microchips, Wearable Electronics & Human/Computer Interfaces
Papers at IEDM 2020 Explore Ways to Leverage 3D Technology's Strengths For Lowering Device Energy Consumption and Energy Lost in Data Transmission. CEA-Leti presented two papers this week at IEDM 2020 that confirm the advantages of combining 3D architectures and resistive-random-access-memories (RRAM) for in-memory computing (IMC), and their applications for Edge-AI and neural networks. The projects were designed to look at different ways to leverage 3D's strengths in lowering device energy consumption as well as energy lost during data transfer.
Invited paper at IEDM 2020 shows benefit of CEA-List’s architectures in co-optimizing CEA-Leti’s 3D toolbox to enable higher bandwidth & heterogeneity for high-performance processors.
CEA is a French government-funded technological research organisation in four main areas: low-carbon energies, defense and security, information technologies and health technologies. A prominent player in the European Research Area, it is involved in setting up collaborative projects with many partners around the world.