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Article | High performance computing
Taking up tomorrow's computing challenges in a connected world: maintaining performance progress while curtailing power consumption.
New computing technologies
CEA-Leti will unveil its latest scientific results in 3D sequential integration for neural networks, 3D RRAM for in-memory computing and GaN-on-Si for power electronics at IEDM 2020, Dec. 12-16. The event will be held virtually because of the coronavirus pandemic.Institute scientists are lead authors on four papers and contributing authors on five more that will be presented during the conference.
What’s new: CEA-Leti today announced a new collaboration with Intel on advanced 3D and packaging technologies for processors to advance chip design. The research will focus on assembly of smaller chiplets.,, optimizing interconnection technologies between the different elements of microprocessors, and on new bonding and stacking technologies for3D ICs, especially for making high performance computing (HPC) applications.
Moovlab, a spinoff of CEA-Leti, a CEA Tech institute, helps gyms improve customer loyalty with fun and interactive virtual circuit training tailored to each user’s individual goals.
CEA-Leti, a CEA Tech institute, is gradually shifting over to more sustainable practices.
Virtual Presentation During VLSI 2020 Details Transistors’ Performance And Power-Use Advantages Versus FinFET Devices
CEA is a French government-funded technological research organisation in four main areas: low-carbon energies, defense and security, information technologies and health technologies. A prominent player in the European Research Area, it is involved in setting up collaborative projects with many partners around the world.